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Mounting features


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Mounting the device

Device has 4x 3.1mm diameter mounting holes, suitable for M3 screws. The mounting hole pads are 5.6mm in diameter. Design any mounting posts to be no greater than 5.6mm in diameter. See the bottom side keepout region in the mounting drawing.

Thermal considerations

No heatsink is installed at the factory, ensure the board temperature stays within safe limits.

If required, the device may be installed onto a suitable plate with a thermally conductive pad sandwiched between the bottom side components and the mounting plate. All heat producing components are mounted on the bottom side of the board.